| 品牌 | 和創億 | 型號 | hcyfpc001f |
| 機械剛性 | 柔性 | 層數 | 多層 |
| 基材 | 銅 | 絕緣材料 | 有機樹脂 |
| 絕緣層厚度 | 薄型板 | 阻燃特性 | v2板 |
| 工藝 | 電解箔 | 增強材料 | 玻纖布基 |
| 絕緣樹脂 | 聚酰亞胺樹脂(pi) | 產品性質 | 新品 |
| 營銷方式 | 直銷 | 營銷 | 優惠 |
銀漿柔性線路板
板厚0.4mm
單板尺寸:397.50*31.75mm,
特殊工藝,最小孔徑0.2mm
項目
| 內容 | 常規 | 特殊 |
1 | 層數 no.of layer | 1～6層 | 8層 |
2 | 完成板尺寸(最大) finished board siae (max) | 250*650mm | ok |
3 | 完成板尺寸(最小) finished board siae (min) | 8mm*12mm | ok |
4 | 板厚度(最大) board thickness (max) | 23 mil (0.6mm) | ok |
5 | 板厚度(最小) board thickness (min) | 3 mil (0.0765mm) | （防焊）0.05mm |
6 | 成品厚度公差(0.085mm≦板厚<0.4mm) fineshed board thickness folerance (0.085mm≦board thickness<0.4mm) | ±2mil(±0.05m) | ok |
7 | 鉆孔孔徑(最大) drill hole diameter (max) | 240 mil (6.0mm) | 6.5mm |
8 | 鉆孔孔徑(最小) drill hole diameter (min) | 8 mil (0.20mm) | 0.15mm |
9 | 外形精度 | ±0.1mm | ±0.05mm |
10 | 完成孔徑(最小) for machine drill fineshed via diameter (min) | 6 mil (0.15mm) | 0.10mm |
11 | 底銅厚度(最小) outer layer base copper thickness (min) | 1/2oz(18um) | 1/3oz |
12 | 底銅厚度(最大) outer layer base copper thickness (max) | 2oz(72um) | 3oz |
13 | 絕緣層厚度(最小) inner layer dielectric thickness (min) | 0.0127mm(pi厚1/2mil) | ok |
14 | 絕緣層厚度(最大) inner layer dielectric thickness (max) | 0. 50mm(pi厚2mil) | ok |
15 | 材料類型 base.material | pi聚酰亞胺/pet聚脂 | 無膠基材 |
16 | 孔電鍍縱橫比(最大) hole plating aspect ratio (max) | 5:1 | ok |
17 | 孔徑公差(鍍通孔) hole diameter tolerance (pth) | ±3mil(±0.076 mm) | ok |
18 | 鉆孔孔徑公差(非鍍通孔) hole diameter tolerancg (npth) | ±2mil(±0.050mm) | ok |
19 | 孔位公差(與cad數相比) hole position toleramce (compared with cad data) | ±1mil(±0.025mm) | ok |
20 | pth孔孔壁銅厚 pth hole copper thickness | ≧0.5mil(≧12.5um) ≦1.0mil(≦25 um) | ≧8.0um |
項目
| 內容 | 常規 | 特殊 |
1 | 層數 no.of layer | 1～6層 | 8層 |
2 | 完成板尺寸(最大) finished board siae (max) | 250*650mm | ok |
3 | 完成板尺寸(最小) finished board siae (min) | 8mm*12mm | ok |
4 | 板厚度(最大) board thickness (max) | 23 mil (0.6mm) | ok |
5 | 板厚度(最小) board thickness (min) | 3 mil (0.0765mm) | （防焊）0.05mm |
6 | 成品厚度公差(0.085mm≦板厚<0.4mm) fineshed board thickness folerance (0.085mm≦board thickness<0.4mm) | ±2mil(±0.05m) | ok |
7 | 鉆孔孔徑(最大) drill hole diameter (max) | 240 mil (6.0mm) | 6.5mm |
8 | 鉆孔孔徑(最小) drill hole diameter (min) | 8 mil (0.20mm) | 0.15mm |
9 | 外形精度 | ±0.1mm | ±0.05mm |
10 | 完成孔徑(最小) for machine drill fineshed via diameter (min) | 6 mil (0.15mm) | 0.10mm |
11 | 底銅厚度(最小) outer layer base copper thickness (min) | 1/2oz(18um) | 1/3oz |
12 | 底銅厚度(最大) outer layer base copper thickness (max) | 2oz(72um) | 3oz |
13 | 絕緣層厚度(最小) inner layer dielectric thickness (min) | 0.0127mm(pi厚1/2mil) | ok |
14 | 絕緣層厚度(最大) inner layer dielectric thickness (max) | 0. 50mm(pi厚2mil) | ok |
15 | 材料類型 base.material | pi聚酰亞胺/pet聚脂 | 無膠基材 |
16 | 孔電鍍縱橫比(最大) hole plating aspect ratio (max) | 5:1 | ok |
17 | 孔徑公差(鍍通孔) hole diameter tolerance (pth) | ±3mil(±0.076 mm) | ok |
18 | 鉆孔孔徑公差(非鍍通孔) hole diameter tolerancg (npth) | ±2mil(±0.050mm) | ok |
19 | 孔位公差(與cad數相比) hole position toleramce (compared with cad data) | ±1mil(±0.025mm) | ok |
20 | pth孔孔壁銅厚 pth hole copper thickness | ≧0.5mil(≧12.5um) ≦1.0mil(≦25 um) | ≧8.0um |