| 品牌 | 勝泰 | 樹脂膠分類 | 環氧樹脂 |
| 型號 | t-5843 | 粘合材料 | 電子元件 |
t-5843 technical data sheet
one component epoxy surface mount adhesive
單組分環氧樹脂貼片膠
product description產品介紹
t-5843surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by syringe dispense method. it has following features.t-5843 貼片膠用于注射器分配法的波峰焊之前將電子元器件或其它的小型部件粘接在印刷電路板上.它具有以下特性.
l high dispense speed高分配速度
l excellent green/wet strength極佳的未固化/濕強度
l high dot profile高的點輪廓
l good electrical properties好的電學性能
l lead free application無鉛化應用
properties of uncured material固化前材料性能
property 性能 | test method 測試方法 | t-5843 |
color/appearance顏色/外觀 | visual | viscous red gel粘稠紅色凝膠 |
specific gravity密度, g/cc, | astm d-792 | 1.2 |
viscosity粘度,cone & plate, pa.s | astm d-2393 | ~126(25°c);~115(30°c); ~100 (35°c) |
yield strength屈服強度,cone & plate, pa, 25°c |
| 150-250 |
typical properties of cured material固化后材料典型物理性能
property 性能 | test method 測試方法 | value 數值 |
coefficient of thermal expansion熱膨脹系數, cte | astm d696 | 100 e-06 |
thermal conductivity熱導率, w/m-k | astm c177 | 0.32 |
glass transition temperature玻璃化轉變溫度, tg,°c | astm d4065 | 115 |
lap shear strength搭接剪切強度, steel鋼, mpa |
| > 16 |
torque strength扭轉強度, fr4 pcb, n.mm |
| 62 |
pull off strength拉離強度, fr4 pcb, n |
| 55 |
volume resistivity體電阻系數, ohms-cm | astm d-257 | 1.5 e+15 |
surface resistivity表面電阻系數, ohms | astm d-257 | 50 e+15 |
dielectric constant電介質常數 | astm d150 | 2.9(1 khz), 2.8(10 khz) |
hot solder dip @260°c熱浸焊@260°c |
| pass通過 |
resistance to lead-free solder無鉛焊接劑的抵抗性 | alcohol / water based flux,260°cdual wave水/酒精基焊劑,260°c雙波峰焊接 | no component loss in the wave在波峰焊中無成分損失 |
surface insulation resistance, reliability/electrical bias表面絕緣抵抗性，可靠性/電偏壓 | 85°c/ 85% rh, 1000 hours85°c/ 85%相對濕度，1000小時 | pass通過 |
directions for use使用方法
typical curing condition典型固化條件: 90 ~ 120 secondsat 150 ºc在150 ºc下保持90 ~ 120秒
curing starts above 100 ºc, with a dsc conversion of 90%, 4 min. at 125 ºc, 10min. at100ºc固化開始于100 ºc以上,在125 ºc保溫4分鐘,在100 ºc保溫10分鐘,熱轉換為90%.
cleaning清除
uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(ipa) or mek.未固化膠粘劑可被輕易從印刷電路板上用異丙醇或丁酮清除
storageinformation保存方法
在5 ºc下密封干燥儲存,保質期為6個月