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電子元器件或其它的小型部件粘接在印刷電路板上的貼片紅膠

品牌 勝泰 樹脂膠分類 環(huán)氧樹脂
型號(hào) t-5838 粘合材料 電子元件

t-5838                                technical data sheet

one component epoxy surface mount adhesive

單組分環(huán)氧樹脂貼片膠

 

product description產(chǎn)品介紹

t-5838 surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by stencil print method. it has following features. t-5838 貼片膠用于模板印刷法的波峰焊之前將電子元器件或其它的小型部件粘接在印刷電路板上.它具有以下特性.

l        a range of dot height with single stencil thickness obtainable可獲得單模板厚度的點(diǎn)高度排列

l        excellent green/wet strength極佳的未固化/濕強(qiáng)度

l        high speed printing高速印刷

 

properties of uncured material固化前材料性能

property

性能

test method

測(cè)試方法

t-5838

color/appearance顏色/外觀

visual

viscous red paste粘稠紅色漿糊

specific gravity密度, g/cc,

astm d-792

1.3

viscosity粘度,cone & plate, pa.s

astm d-2393

20-45(25°c)

yield strength屈服強(qiáng)度,cone & plate, pa, 25°c

 

400-600

 

typical properties of cured material固化后材料典型物理性能

property

性能

test method 

測(cè)試方法

value

數(shù)值      

coefficient of thermal expansion熱膨脹系數(shù), cte

astm d696

85 e-06

thermal conductivity導(dǎo)熱率, w/m-k

astm c177

0.25

glass transition temperature玻璃化轉(zhuǎn)變溫度, tg,°c

astm d4065

135

lap shear strength, steel搭接剪切強(qiáng)度, mpa

 

20

torque strength扭轉(zhuǎn)強(qiáng)度, fr4 pcb, n.mm

 

55

pull off strength拉離強(qiáng)度, fr4 pcb, n

 

50

volume resistivity體電阻系數(shù), ohms-cm

astm d-257

5 e+15

surface resistivity表面電阻系數(shù), ohms

astm d-257

30 e+15

dielectric constant電介質(zhì)常數(shù)

astm d150

2.8(1 khz), 2.7(10 khz)

hot solder dip @260°c熱浸焊@260°c

 

pass

humidity 98%rh / 40°c, 1000 hours, strength retention

相對(duì)濕度98%/40°c下1000小時(shí)后的強(qiáng)度保持

 

80%

 

directions for use使用方法

typical curing condition典型固化條件:                90 ~ 120 secondsat 150 ºc在150 ºc下保持90 ~ 120秒

curing starts above 100 ºc, with a dsc conversion of 90%, 2 min. at 125 ºc, 10min. at 100 ºc固化開始于100 ºc以上,在125 ºc保溫2分鐘,在100 ºc保溫10分鐘,熱轉(zhuǎn)換為90%.

 

cleaning清除
uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(ipa) or mek.未固化膠粘劑可被輕易從印刷電路板上用異丙醇或丁酮清除

 

storageinformation保存方法

在5 ºc下密封干燥儲(chǔ)存,保質(zhì)期為6個(gè)月