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電子元器件或其它的小型部件粘接的貼片紅膠

品牌 勝泰 樹脂膠分類 環(huán)氧樹脂
型號(hào) t-5829 粘合材料 電子元件

t-5829                                technical data sheet

one component epoxy surface mount adhesive

單組分環(huán)氧樹脂貼片膠

 

product description產(chǎn)品介紹

t-5829 surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by pin transfer method. it has following features.t-5829 貼片膠用于在針轉(zhuǎn)移法的波峰焊之前將電子元器件或其它的小型部件粘接在印刷電路板上.它具有以下特性.

l        low moisture absorption潮氣吸收率低

l        excellent green/wet strength極佳的未固化/濕強(qiáng)度

l        high dot profile and resists slumping and stringing極好的點(diǎn)狀外觀,抗流淌和拉絲

l        broad equipment capability with high-volume screen printing滿足大體積絲網(wǎng)印刷的設(shè)備通用性

 

properties of uncured material固化前材料性能

property

性能

test method

測試方法

t-5829

color/appearance顏色/外觀

visual

viscous red gel粘稠紅色凝膠

specific gravity密度, g/cc,

astm d-792

1.21

viscosity粘度, (cp), 25℃

astm d-2393

~20,000

yield strength屈服強(qiáng)度,cone & plate, pa, 25°c

 

200-300

typical properties of cured material固化后材料典型物理性能

property性能

test method測試方法

value數(shù)值

coefficient of thermal expansion熱膨脹系數(shù), cte

astm d696

140 e-06

thermal conductivity熱導(dǎo)率, w/m-k

astm c177

0.4

lap shear strength搭接剪切強(qiáng)度, steel鋼, mpa

 

28

torque strength扭轉(zhuǎn)強(qiáng)度, fr4 pcb, n.mm

 

50 - 80

volume resistivity體電阻系數(shù), ohms-cm

astm d-257

2.1 e+15

surface resistivity表面電阻系數(shù), ohms

astm d-257

2.0 e+15

dielectric constant電介質(zhì)常數(shù)

astm d150

3.7(1 khz), 3.6(10 khz)

torque retention 30 seconds @100°c+3 seconds @260°cflux and wave solder波峰焊中30秒@100°c+3秒@260°c的扭力保持

 

100 %

hot solder dip @260°c熱浸焊@260°c

 

pass通過

 

directions for use使用方法

typical curing condition典型固化條件:                                    3 min. at 150 ºc在150 ºc下保持3分鐘

curing starts above 100 ºc, with a dsc conversion of 90%, 5 min. at 125 ºc.固化開始于100 ºc以上,在125 ºc保溫5分鐘,熱轉(zhuǎn)換為90%.

 

cleaning清除
uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(ipa) or mek.未固化膠粘劑可被輕易從印刷電路板上用異丙醇或丁酮清除

 

storageinformation保存方法

在5 ºc下密封干燥儲(chǔ)存,保質(zhì)期為6個(gè)月