drain voltage ............................................ -0.3 to 700 v
drain peak current: top232 ................................. 0.8 a
top233 ................................. 1.6 a
top234 ................................. 2.4 a
control voltage .......................................... -0.3 to 9 v
control current ...............................................100 ma
multi-function pin voltage .................... -0.3 to 9 v
frequency pin voltage............................... -0.3 to 9 v
ic = 4 ma;
tj = 25 °c
ic = icd1
fosc
δf
fm
dcmax
dcmin
tsoft
control functions
conditions
(unless otherwise specified)
see figure 34
source = 0 v; tj = -40 to 125 °c
parameter symbol min typ max units
thermal impedance
khz
khz
hz
%
%
ms
%/ma
thermal impedance: y package (θja)(1) ............... 70 °c/w
(θjc)(2) ................. 2 °c/w
p/g package:
(θja) ........ 45 °c/w(3); 35 °c/w(4)
(θjc)(5) .......................... 11 °c/w
notes:
1. free standing with no heatsink.
2. measured at the back surface of tab.
3. soldered to 0.36 sq. inch (232 mm2), 2oz. (610 gm/m2) copper clad.
4. soldered to 1 sq. inch (645 mm2), 2oz. (610 gm/m2) copper clad.
5. measured on the source pin close to plastic interface.
124 132 140
61.5 66 70.5
± 4
± 2
250
75.0 78.0 82.0
35.0 47.0 57.0
0.8 1.5 2.7
10 14
i -27 -22 -17 c = 4 ma; tj = 25 °c
switching
frequency
(average)
frequency jitter
deviation
frequency jitter
modulation rate
maximum duty
cycle
minimum duty
cycle (prior to
cycle skipping)
soft start time
pwm
gain
frequency pin
connected to source
frequency pin
connected to control
132 khz operation
66 khz operation
im ≤ im(dc)
im = 190 μa
tj = 25 °c; dcmin todcmax
storage temperature ..................................... -65 to 150 °c
operating junction temperature(2) ................ -40 to 150 °c
lead temperature(3) ................................................ 260 °c
notes:
1. all voltages referenced to source, ta = 25 °c.
2. normally limited by internal circuitry.
3. 1/16" from case for 5 seconds.

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