features
1. low-profile capacitors with the
maximum height of 1.2 mm
(cases a and b) and offering low
esr.
2. suitable for surface mounting.
3. dimensional accuracy and symmetrical
terminal structure suitable
for high-density mounting
ensures excellent “self-alignment”.
4. meet the demand for resistance to
soldering heat by 260°c for 10
seconds dipping. also, meet
reflow and flow soldering.
5. suitable for small-sized electronic
devices, such as dvc, dsc and
pcmcia cards, and high-function
compact portable devices, such
as mobile phones and phs.

特征
1。與低姿態(tài)的電容
最大高度為1.2毫米
（例a和b），并低
的esr。
2。表面合適的安裝。
3。尺寸精度和對稱
終端結(jié)構(gòu)適合
安裝高密度
確保卓越的“自我調(diào)整“。
4。滿足性要求
焊接熱量260 °c的10
秒浸漬。此外，滿足
回流焊接和流量。
5。適用于小型電子
如分區(qū)指揮官，dsc和設(shè)備，
pcmcia卡，以及高功能
小巧便攜設(shè)備，例如
隨著手機和小靈通。