嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) AX500-1FGG676I品牌、價(jià)格、PDF參數(shù)
AX500-1FGG676I 品牌、價(jià)格
| 元器件型號(hào) |
廠商 |
描述 |
數(shù)量 |
價(jià)格 |
| AX500-1FGG676I |
Microsemi SoC |
IC FPGA AXCELERATOR 500K 676FBGA |
0 |
40:$247.43325
|
| A54SX72A-FG484A |
Microsemi SoC |
IC FPGA SX-A 108K 484-FBGA |
0 |
10,000:$247.15000
|
| A54SX72A-FGG484A |
Microsemi SoC |
IC FPGA SX-A 108K 484-FBGA |
0 |
10,000:$247.15000
|
| AGLE600V2-FG484I |
Microsemi SoC |
IC FPGA 1KB FLASH 600K 484-FBGA |
0 |
60:$245.91700
|
| AGLE600V2-FGG484I |
Microsemi SoC |
IC FPGA 1KB FLASH 600K 484-FBGA |
0 |
60:$245.91700
|
AX500-1FGG676I PDF參數(shù)
| 類別: |
嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列)
|
| LAB/CLB數(shù): |
-
|
| 邏輯元件/單元數(shù): |
5376
|
| RAM 位總計(jì): |
73728
|
| 輸入/輸出數(shù): |
336
|
| 門數(shù): |
500000
|
| 電源電壓: |
1.425 V ~ 1.575 V
|
| 安裝類型: |
表面貼裝
|
| 工作溫度: |
-40°C ~ 85°C
|
| 封裝/外殼: |
676-BGA
|
| 供應(yīng)商設(shè)備封裝: |
676-FBGA(27x27)
|