| 項目 | 技術標準 | 備注 |
| 層數 | 1-12層 | |
| 材料 | fr-4,taconic,rogers,metal-backed laminate | 可使用高tg料(tg≥170℃) |
| 板厚 | 0.2mm-3.2mm(8mil-126mil) | |
| 最小芯板厚 | 0.075mm(3mil) | |
| 銅厚 | 1/2 oz min;5 oz max | |
| 最小線寬/間距 | 0.075mm/0.1mm(3mil/4mil) | |
| 最小鉆孔孔徑 | 0.2mm(8mil) | |
| 最小沖孔孔徑 | 0.9mm(35mil) | |
| 最大拼板尺寸 | 610mm×508mm | |
| 尺寸公差 | 孔位 | +/-0.075mm(3mil) cnc driling | |
| 線寬 | +/-0.05mm(2mil)or | |
| +/-20% of original artwork | |
| 孔徑 | pth l:+/-0.075mm(3mil) | |
| non-pth l:+/-0.05mm(2mil) | |
| 外型公差 | +/-0.125mm(5mil) cnc routing | |
| +/-0.15mm(6mil) by punching | |
| 翹曲度 | 0.70% | |
| 絕緣電阻 | 10kohm-20mohm | |
| 傳導電阻 | <50ohm | |
| 測試電壓 | 10-300v | |
| v刻 | 拼版尺寸 | 110×100mm(min) | |
| 660×600mm(max) |
| 多層板 | 層間偏差 | 4 layers:0.15mm(6mil)max | |
| 6 layers:0.25mm(10mil)max | |
| 最小孔至內層圖形距離 | 0.25mm(10mil) | |
| 最小板邊到內層圖形距離 | 0.25mm(10mil) | |
| 板厚公差 | 4 layers:+/-0.13mm(5mil) | |
| 6 layers:+/-0.15mm(6mil) | |
| 特性阻抗 | +/-10% | |
| 差動阻抗 | +-/10% | |