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參數資料
| 型號： | 2723CXXX |
| 元件分類： | 通信、網絡模塊及開發工具 |
| 英文描述： | Telecomm/Datacomm |
| 中文描述： | 電信/數據通信 |
| 文件頁數： | 2/11頁 |
| 文件大?。?/td> | 251K |
| 代理商： | 2723CXXX |
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
2
Agere Systems Inc.
Description
(continued)
With this design configuration, tunable chirp transmis-
sion for maximum reach can be achieved. Also, bal-
anced drive voltages can produce zero-chirp operation.
Low drive voltages enable the use of IC chip drivers
such as the Agere Systems TMOD0110G, which sup-
ports a small and low-cost driver solution.
Controlled Feedback (D2625P)
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30 dB.
Controlled Temperature (D2525P)
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating
and cooling of the laser chip to maintain a temperature
of 25 °C for case temperatures from –40 °C to +70 °C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
Controlled Power (D2525P)
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain consistent
laser output power.
Pin Information
1. A positive current through the thermoelectric heat pump cools the
laser.
2. For optimum performance, both leads should be grounded.
Table 1. Pin Descriptions
Pin
Name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Thermistor
Thermistor
Laser dc Bias (Cathode) (–)
Back-facet Monitor Anode (–)
Back-facet Monitor Cathode (+)
Thermoelectric Cooler (+)
1
Thermoelectric Cooler (–)
1
Case Ground
Case Ground
Case Ground
Laser Anode (+)
2
RF Laser Input Cathode (–)
Laser Anode (+)
2
Case Ground
RF/dc Input Data or
Data
RF/dc Input Data or
Data
Figure 1. Circuit Schematic
2623W
43
0.2
μ
F
43
0.2
μ
F
Top view.
1-567
TEC
L1
160 nH
ISOLATOR
R1
20
PACKAGE
GROUNDS
–
+
+
–
–
+
–
+
7
6
5
4
3
2
1
8
9
10
11
12
13
TH
10 k
14
15 16
D2525P
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