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參數資料
| 型號： | 3-1640240-3 |
| 廠商： | Tyco Electronics |
| 元件分類： | 終端 |
| 英文描述： | Matrix Series Ball Grid Array (BGA) Sockets |
| 中文描述： | 矩陣系列球形柵格陣列（BGA）插座 |
| 文件頁數： | 2/5頁 |
| 文件大小： | 3796K |
| 代理商： | 3-1640240-3 |
Matrix Series BGA Sockets
2
Compression Force: 45 grams/contact nominal
Durability:
20 cycles dependent on application
ELECTRICAL
MECHANICAL
Current Capability:
4 amps per column max
Contact Resistance: 50 milliohms max
Insulation Resistance: 1000 megohms at 100 VDC
Inductance: Self .4nH, Mutual .2nH
Capacitance: .1pF
ENVIRONMENTAL
Operating Temperature: 0°C to 90°C
Close up of corner frame and
HXC Polymer contacts
The HXC 125 socket provides a compression mount solderless interconnect. Ahardware system is required to generate
the necessary forces. Tyco Electronics offers a complete hardware solution for each socket size. Each hardware kit
contains enough hardware for one socket - a spring plate, a top plate, a bolster plate with insulator.
Polyimide
Carrier
Well
BGABall
HXC 125
Polymer
Contact
BGA
Package
FullArray
Stop
Contact to Solder Ball Interface
Spring
Plate
System shown fully compressed
Side view fully compressed
PC Board
HXC 125
Polymer Socket
Top Support
Plate
Actuation
Screw
Bolster
Plate
BGA
Device
相關PDF資料 |
PDF描述 |
|---|---|
| 3-1640240-4 | Matrix Series Ball Grid Array (BGA) Sockets |
| 3-1640240-5 | Matrix Series Ball Grid Array (BGA) Sockets |
| 3-1640240-6 | Matrix Series Ball Grid Array (BGA) Sockets |
| 3-1640240-7 | Matrix Series Ball Grid Array (BGA) Sockets |
| 3-1640240-8 | Matrix Series Ball Grid Array (BGA) Sockets |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 3164024T00B | 制造商:SL POWER ELECTRONICS INC.- AULT 功能描述:EXTERNAL AND MEDICAL POWER SUPPLIES, AND BATTERY CHARGERS |
| 316-4024-T00B | 制造商:SL Power Electronics 功能描述:EXTERNAL AND MEDICAL POWER SUPPLIES, AND BATTERY CHARGERS |
| 3-1640258-5 | 制造商:TE Connectivity 功能描述:CONN BGA SCKT SKT 2500 POS SLDR ST SMD - Bulk |
| 316403101 | 制造商:Frigidaire 功能描述:SEAL,OVEN DOOR |
| 316403200 | 制造商:Frigidaire 功能描述:LINER 制造商:FRIGIDAIRE 功能描述:LINER |
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