
3M Through-Board Socket
2 mm x 2 mm Straight, Dual Entry, Solder Tail
953 Series
Maximizes use of PC board space
High temperature dielectric
“No lead” wave and reflow solder compatible
Dual row design, 4–80 pins
Minimized PC Board stacking heights
Mates with pin-strip header products
See Regulatory Information Appendix for
chemical compliance information
Date Modified: July 30, 2008
TS-2162-C
Sheet 1 of 2
Physical
Insulation
Material: High Temperature Thermoplastic
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 1.25–2.5 m [100 ’’] Nickel
Wiping Area: 0.25 m [10 ’’] Gold
Solder Tail Area: 1–3 m [40–118 ’’] Matte Tin
Electrical
Current Rating: 1 A
Insulation Resistance: > 5 x 108 Ohm at 100 V
DC
Withstanding Voltage: 1000 V
DC
Transition Resistance: ≤ 20 mOhm
Environmental
Temperature Range: -40 °C ... +105 °C
Processing Temperature: max. 260 °C (Profile per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
Interconnect Solutions
http://www.3M.com/interconnects/
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