
3M Boardmount Socket
2.54 mm and 2.54 mm x 2.54 mm, Side Entry, Surface Mount
960 Series
High temperature dielectric
“No lead” reflow solder compatible
Single- and dual row design, 4–30 pins or 8–60 pins
Mates with pin-strip header products
See Regulatory Information Appendix for chemical
compliance information
Date Modified: October 16, 2008
TS-2189-B
Sheet 1 of 2
Physical
Insulation
Material: High Temperature Thermoplastic
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 1.25–2.5 μm [50–100 μ’’] Nickel
Wiping Area: 0.25 μm [10 μ’’] Gold
Solder Tail Area: 1–3 μm [40–118 μ’’] Matte Tin
Electrical
Current Rating: 2 A
Insulation Resistance: > 5 x 108 Ohm at 100 V
DC
Withstanding Voltage: 1000 V
DC
Environmental
Temperature Range:
-25 °C to +105 °C
Processing Temperature:
max. 260 °C (Profile per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C)
Interconnect Solutions
http://www.3M.com/interconnects/
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