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參數(shù)資料
| 型號(hào)： | AD7849TQ |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | DAC |
| 英文描述： | Serial Input, 14-Bit/16-Bit DAC |
| 中文描述： | SERIAL INPUT LOADING, 7 us SETTLING TIME, 16-BIT DAC, CDIP20 |
| 封裝： | CERDIP-20 |
| 文件頁(yè)數(shù)： | 4/15頁(yè) |
| 文件大小： | 211K |
| 代理商： | AD7849TQ |
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REV. B
–4–
AD7849
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25
°
C unless otherwise noted)
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to +17 V
V
CC
to DGND
2
. . . . . . . . . . . . . . . . . . –0.4 V, V
DD
+ 0.4 V or
+7 V (Whichever Is Lower)
V
SS
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to –17 V
V
REF+
to DGND . . . . . . . . . . . . . . . . V
DD
+ 0.4 V, V
SS
– 0.4 V
V
REF–
to DGND . . . . . . . . . . . . . . . . V
DD
+ 0.4 V, V
SS
– 0.4 V
V
OUT
to DGND
3
. . . . . . . . . . . . . .V
DD
+ 0.4 V, V
SS
– 0.4 V or
±
10 V (Whichever Is Lower)
R
OFS
to DGND . . . . . . . . . . . . . . . . . V
DD
+ 0.4 V, V
SS
– 0.4 V
Digital Input Voltage to DGND . . . . . . –0.4 V to V
CC
+ 0.4 V
Input Current to any Pin Except Supplies
4
. . . . . . . . .
±
10 mA
Operating Temperature Range
Commercial/Industrial (A, B, C Versions). . . .–40
°
C to +85
°
C
Extended (T Version) . . . . . . . . . . . . . . . .–55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . .–65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Plastic DIP Package, Power Dissipation . . . . . . . . . . .875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 102
°
C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +260
°
C
SOP Package, Power Dissipation . . . . . . . . . . . . . . . . .875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 74
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . .875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 71
°
C/W
Lead Temperature, Soldering (Soldering 10 secs) . . . 260
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
V
must not exceed V
by more than 0.4 V. If it is possible for this to happen
during power-up or power-down (for example, if V
is greater than +0.4 V while
V
DD
is still 0 V), the following diode protection scheme will ensure protection.
SD103C
1N5711
1N5712
1N4148
V
DD
V
CC
V
DD
V
CC
AD7849
3
V
OUT
may be shorted to DGND, +10 V, –10 V, provided that the power dissipation
of the package is not exceeded.
4
Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7849 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Temperature
Range
Resolution
(Bits)
Bipolar
INL (LSBs)
Package
Option
*
Model
AD7849AN
AD7849BN
AD7849CN
AD7849AR
AD7849BR
AD7849CR
AD7849TQ
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
14
16
16
14
16
16
16
±
3
±
8
±
4
±
3
±
8
±
4
±
8
N-20
N-20
N-20
R-20
R-20
R-20
Q-20
*N = Plastic DIP; R = SOP (Small Outline Package); Q = Cerdip.
PIN CONFIGURATION
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
AD7849
NC = NO CONNECT
V
REF+
V
DD
NC
V
OUT
R
OFS
V
REF
–
V
SS
SYNC
RSTIN
RSTOUT
AGND
SCLK
V
CC
SDOUT
DCEN
BIN
/COMP
DGND
LDAC
SDIN
CLR
WARNING!
ESD SENSITIVE DEVICE
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