| 元器件型號 | 廠商 | 描述 | 數量 | 價格 |
|---|---|---|---|---|
| BUJD103AD,118 | NXP Semiconductors | TRANS NPN 400V 4A TO252 | 0 | 7,500:$0.34580 |
| BUJ302A,127 | NXP Semiconductors | TRANS NPN 400V 4A TO-220AB | 0 | 2,000:$0.32596 |
| BUJ105AD,118 | NXP Semiconductors | TRANS NPN 400V 8A DPAK | 0 | 10,000:$0.32000 |
| BUJ302AD,118 | NXP Semiconductors | TRANS NPN 400V 4A DPAK | 0 | 1:$0.90000 10:$0.78500 25:$0.69400 100:$0.60470 250:$0.52636 500:$0.44806 1,000:$0.35888 |
| BUJ302AD,118 | NXP Semiconductors | TRANS NPN 400V 4A DPAK | 0 | 1:$0.90000 10:$0.78500 25:$0.69400 100:$0.60470 250:$0.52636 500:$0.44806 1,000:$0.35888 |
| 類別: | 分離式半導體產品 |
|---|---|
| 晶體管類型: | NPN |
| 電流 - 集電極 (Ic)(最大): | 4A |
| 電壓 - 集電極發射極擊穿(最大): | 400V |
| Ib、Ic條件下的Vce飽和度(最大): | 1V @ 1A,4A |
| 電流 - 集電極截止(最大): | 100µA |
| 在某 Ic、Vce 時的最小直流電流增益 (hFE): | 11 @ 2A,5V |
| 功率 - 最大: | 80W |
| 頻率 - 轉換: | - |
| 安裝類型: | 表面貼裝 |
| 封裝/外殼: | TO-252-3,DPak(2 引線+接片),SC-63 |
| 供應商設備封裝: | D-Pak |
| 包裝: | 帶卷 (TR) |