
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M HDC Header
.100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit
HDC Series
High density, up to 240 contacts single bay and 366
contacts dual bay
Early Mate Late Break (EMLB) grounding contacts
for hot swapping
Mates with three-row and four-row sockets
See Regulatory Information Appendix (RIA) for
chemical compliance information
Date Modified: March 25, 2008
TS-1136-C
Sheet 1 of 7
Physical
Insulation:
Material: Glass Filled Thermoplastic (LCP)
Flammability: UL 94V-0
Color: Black
Contact:
Material: Copper Alloy
Plating:
Underplating: 50 μ” [ 1.27 μm ] min. Nickel
Wiping Area: See Ordering Information
Termination Area: See Ordering Information
Marking: Part Number and Date Code
Electrical
Current Rating: 3.0 A
Insulation Resistance: 1 x 103 M
Ω min. at 500V
DC
Withstanding Voltage: 900 V
AC for 1 minute
Environmental
Temperature Rating: -55°C to +105°C
Process Rating: Maximum 260°C (per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
UL File No.: E68080