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參數資料
| 型號： | HMMC-1015 |
| 元件分類： | 衰減器 |
| 英文描述： | 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| 封裝： | CHIP |
| 文件頁數： | 4/7頁 |
| 文件大小： | 165K |
| 代理商： | HMMC-1015 |
4
Figure 2. HMMC-1015 Bonding Pad Locations.
RFOUT
RFIN
DCIN
DCOUT
V1
V2
4 Wire Bonds using 0.7 mil dia.
Gold Bond Wire
(length NOT important)
2.0 mil
nom. gap
TC721R
Figure 3. HMMC-1015 Assembly Diagram.
610
0
233
476
0
584
887
994
1410
1470
Notes:
1. All dimensions in microns and shown to center of bond pad.
2. DCin, V1, DCout, and V2 bonding pads are 75 x 75 microns.
3. RF input and output bonding pads are 60 x 70 microns.
4. Chip thickness: 127
± 15 m.
相關PDF資料 |
PDF描述 |
|---|---|
| HMMC-1015 | 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| HMMC-2007 | 0 MHz - 8000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.4 dB INSERTION LOSS |
| HMMC-2027 | 0 MHz - 26500 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 3 dB INSERTION LOSS |
| HMMC-2027 | 0 MHz - 26500 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 3 dB INSERTION LOSS |
| HMMC-3040 | 20000 MHz - 43000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HMMC-2006 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:DC-6 GHz Unterminated SPDT Switch |
| HMMC-2007 | 制造商:Agilent Technologies 功能描述:RF SWIT SPDT DC TO 8GHZ 38DB CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-2027 | 制造商:Agilent Technologies 功能描述:RF SWIT SPDT 0MHZ TO 26.5GHZ 27DB CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3002 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3004 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/4 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
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