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參數資料
| 型號： | MC14503BDR2 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | Full Featured -48V Hot Swap Power Manager, Industrial Temp. 14-TSSOP -40 to 85 |
| 中文描述： | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDSO16 |
| 封裝： | SOIC-16 |
| 文件頁數： | 6/8頁 |
| 文件大小： | 185K |
| 代理商： | MC14503BDR2 |
MC14503B
http://onsemi.com
6
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
0.25 (0.010)
SEATING
PLANE
1
8
9
16
K
–T–
M
A
M
T
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MIN
0.740
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
0.110
0.295
0
0.020
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
2.54 BSC
1.27 BSC
0.21
2.80
7.50
0
0.51
MAX
19.55
6.85
4.44
0.53
1.77
MILLIMETERS
INCHES
0.015
0.130
0.305
10
0.040
0.38
3.30
7.74
10
1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUMMOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUMMATERIAL CONDITION.
1
8
16
9
SPLANE
F
J
M
R
X 45
G
8 PL
P
–B–
–A–
M
0.25 (0.010)
B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010)
A
S
T
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
9.80
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
0
5.80
0.25
MAX
10.00
4.00
1.75
0.49
1.25
MIN
0.386
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
0
0.229
0.010
MAX
0.393
0.157
0.068
0.019
0.049
INCHES
MILLIMETERS
0.25
0.25
7
6.20
0.50
0.009
0.009
7
0.244
0.019
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