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參數(shù)資料
型號(hào): W83601R
廠商: WINBOND ELECTRONICS CORP
元件分類(lèi): 微控制器/微處理器
英文描述: Winbond SMBus GPI/O
中文描述: 15 I/O, PIA-GENERAL PURPOSE, PDSO20
封裝: 0.209 INCH, SSOP-20
文件頁(yè)數(shù): 15/17頁(yè)
文件大小: 194K
代理商: W83601R
Preliminary
Publication Release Date: Aug. 1999
- 14 - Revision 0.32
9. PACKAGE DRAWING AND DIMENSIONS
20 SSOP-209 mil
1
2
D
E
e
Y
b
A1
A2 A
SEATING PLANE
DTEAIL A
L
L1
DETAIL A
SEATING PLANE
E
H
10
11
0
0.002
0.065
0.197
0.291
7.80
0.65
0.75
1.25
0
7.40
8
8.20
5.30
b
c
E
H
E
D
6.90
5.00
A1
A2
A
5.60
7.50
7.20
2.00
1.85
0.38
0.25
8
0.323
0.307
0.0256
0.073
0.015
0.010
0.079
0.220
0.272
0.295
0.283
0.209
MIN.
DIMENSION IN INCH
SYMBOL
DIMENSION IN MM
MIN.
NOM
MAX.
MAX.
NOM
0.05
1.65
e
L
L1
Y
0.009
0.004
0.021
0.030
0.050
0.004
0.22
0.09
0.55
0.10
0.95
0.037
1.75
0.069
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners
.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.
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