
W981616BH
- 2 -
PIN DESCRIPTION
PIN NUMBER PIN NAME
20
24,
27
32
19
FUNCTION
DESCRIPTION
A0
A10
Address
Multiplexed pins for row and column address.
Row address: A0
A10. Column address: A0
A7.
Select bank to activate during row address latch time,
or bank to read/write during column address latch
time.
BA
Bank Select
2, 3, 5, 6, 8, 9,
11, 12, 39, 40,
42, 43, 45, 46,
48, 49
DQ0
DQ15
Data Input/
Output
Multiplexed pins for data input and output.
18
CS
Chip Select
Disable or enable the command decoder. When
command decoder is disabled, new command is
ignored and previous operation continues.
17
RAS
Row Address
Strobe
Command input. When sampled at the rising edge of
the clock,
RAS
,
CAS
and
WE
define the operation
to be executed.
16
CAS
Column
Address Strobe
Referred to
RAS
15
WE
Write Enable Referred to
RAS
36, 14
UDQM/
LDQM
Input/Output
Mask
The output buffer is placed at Hi-Z (with latency of 2)
when DQM is sampled high in read cycle. In write
cycle, sampling DQM high will block the write
operation with zero latency.
35
CLK
Clock Inputs
System clock used to sample inputs on the rising
edge of clock.
34
CKE
Clock Enable CKE controls the clock activation and deactivation.
When CKE is low, Power Down mode, Suspend
mode, or Self Refresh mode is entered.
1, 25
V
CC
Power (+3.3V) Power for input buffers and logic circuit inside DRAM.
26, 50
V
SS
Ground
Ground for input buffers and logic circuit inside
DRAM.
7, 13, 38, 44,
V
CC
Q
Power (+3.3V)
for I/O buffer
Separated power from V
CC
, used for output buffers to
improve noise immunity.
4, 10, 41, 47
V
SS
Q
Ground for I/O
buffer
Separated ground from V
SS
, used for output buffers
to improve noise immunity.
33, 37
NC
No Connection No connection