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參數資料
型號: WF5027BQ-4
廠商: Seiko NPC Corporation
英文描述: Crystal Oscillator Module ICs
中文描述: 晶體振蕩器模塊集成電路
文件頁數: 3/21頁
文件大小: 815K
代理商: WF5027BQ-4
WF5027 series
SEIKO NPC CORPORATION —3
PAD LAYOUT
(Unit:
μ
m)
5027A
×
(for Flip Chip Bonding)
PAD DIMENSIONS
PIN DESCRIPTION
BLOCK DIAGRAM
I
, M
×
, Q
×
I
5027B
(for Wire Bonding (type I))
×
, N
×
, R
×
I
5027C
(for Wire Bonding (type II))
×
, P
×
, S
×
Chip size: 0.75
Chip thickness: 130 ± 15μm
PAD size: 90μm
Chip base: V
SS
×
0.69mm
level
Chip size: 0.75
Chip thickness: 130 ± 15μm
PAD size: 90μm
Chip base: V
SS
×
0.69mm
level
Chip size: 0.75
Chip thickness: 130 ± 15μm
PAD size: 90μm
Chip base: V
SS
×
0.69mm
level
Pad No.
Pad dimensions [μm]
Pad No.
Pin
Name
Description
X
Y
5027A
5027M
5027Q
×
×
×
5027B
5027N
5027R
×
×
×
5027C
5027P
5027S
×
×
×
1
229
114
1
2
1
XT
Amplifier input
Crystal connection pins. Crystal is connected
between XT and XTN.
2
520
114
2
1
2
XTN
Amplifier output
3
636
304
3
6
5
VDD
(+) supply voltage
4
636
531
4
5
4
Q
Output
Output frequency determined by internal circuit
to one of f
O
, f
O
/2, f
O
/4, f
O
/8, f
O
/16, f
O
/32, f
O
/64
5
114
531
5
4
3
VSS
(–) ground
6
114
304
6
3
6
INHN
Output state
control input
High impedance when LOW (oscillator stops).
Power-saving pull-up resistor built-in.
Q
VDD
XTN
VSS
(0,0)
(750,690)
X
Y
INHN
XT
1
2
3
4
6
5
VSS
INHN
XT
Q
(0,0)
(750,690)
X
Y
VDD
XTN
1
2
3
4
6
5
Q
VSS
XTN
VDD
(0,0)
(750,690)
X
Y
INHN
XT
1
2
3
4
6
5
XT
INHN
XTN
Q
CMOS
R
D
C
G
VSS
VDD
C
D
R
F
VRG
DIVIDER
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相關代理商/技術參數
參數描述
WF5027BR-4 制造商:NPC 制造商全稱:Nippon Precision Circuits Inc 功能描述:Crystal Oscillator Module ICs
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WF5027BW-4 制造商:NPC 制造商全稱:Nippon Precision Circuits Inc 功能描述:Crystal Oscillator Module ICs