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參數資料
| 型號： | 992215735021 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, CPGA76 |
| 封裝： | PGA-76 |
| 文件頁數： | 8/17頁 |
| 文件大小： | 171K |
| 代理商： | 992215735021 |
1999 September
16
Philips Semiconductors
Product specification
Frame Transfer CCD Image Sensor
FTT1010-M
Package information
Figure 14 - Mechanical drawing of the PGA package of the FTT1010-M
A is the center of the image area.
Position of A:
26 ± 0.15 to left edge of package
20 ± 0.10 to bottom of package
Angle of rotation: less than ± 10
Sensor flatness: < 7 m (P-V)
Cover glass: Corning 7059
Thickness of cover glass: 1.00 ± 0.05
Refractive index: n
d = 1.53
Single sided AR coating inside (430-660 nm)
All drawing units are in mm
Chip - bottom package 1.7 ± 0.15
1.4 / 100
COVER GLASS
SENSOR CRYSTAL
Chip - cover glass 1.3 ± 0.20
A ZONE
TOP VIEW
INDEX
MARK
PIN 1
40 ± 0.40
26 ± 0.15
1.27
±
0.15
8.9
0.46± 0.05
(2.54)
STAND-OFF PIN
COVER GLASS
40
±
0.40
BOTTOM VIEW
Cover glass 1.0 ± 0.05
Image sensor chip
4.57
±
0.15
Top cover glass to top chip 2.4 ± 0.25
20
±
0.10
23
±
0.33
30.48
±
0.20
35.56 ± 0.20
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