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參數資料
| 型號： | W986408BH |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | 2M words x 8 bit x 4 Banks SDRAM(2M字 x 8 位 x 4 組同步動態RAM) |
| 中文描述： | 200萬字× 8位× 4個銀行的SDRAM（200萬字× 8位× 4組同步動態RAM）的 |
| 文件頁數： | 10/44頁 |
| 文件大小： | 1858K |
| 代理商： | W986408BH |
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W986408BH
2M x 8 bit x 4 Banks SDRAM
Revision 1.2 Publication Release Date: April, 1999
- 10 -
Functional Description
Power Up and Initialization
The default power up state of the mode register is unspecified. The following power up and initialization sequence need to be
followed to guarantee the device being preconditioned to each user specific needs.
During power up, all V
DD
and V
DD
Q pins must be ramp up simultaneously to the specified voltage when the input signals are held
in the "NOP" state. The power up voltage must not exceed V
DD
+0.3V on any of the input pins or V
DD
supplies. After power up, an
initial pause of 200us is required followed by a precharge of all banks using the precharge command. To prevent data contention
on the DQ bus during power up, it is required that the DQM and CKE pins be held high during the initial pause period. Once all
banks have been precharged, the Mode Register Set Command must be issued to initialize the Mode Register. An additional eight
Auto Refresh cycles (CBR) are also required before or after programming the Mode Register to ensure proper subsequent
operation.
Programming Mode Register
After initial power up, the Mode Register Set Command must be issued for proper device operation. All banks must be in a
precharged state and CKE must be high at least one cycle before the Mode Register Set Command can be issued. The Mode
Register Set Command is activated by the low signals of RAS, CAS, CS and WE at the positive edge of the clock. The address
input data during this cycle defines the parameters to be set as shown in the Mode Register Operation table. A new command may
be issued following the mode register set command once a delay equal to tRSC has elapsed. Please refer to the next page for
Mode Register Set Cycle and Operation Table.
Bank Activate Command
The Bank Activate command must be applied before any Read or Write operation can be executed. The operation is similar to
RAS# activate in EDO DRAM. The delay from when the Bank Activate command is applied to when the first read or write
operation can begin must not be less than the RAS to CAS delay time (t
RCD
). Once a bank has been activated it must be precharged
before another Bank Activate command can be issued to the same bank. The minimum time interval between successive Bank
Activate commands to the same bank is determined by the RAS cycle time of the device (t
RC
). The minimum time interval between
interleaved Bank Activate commands (Bank A to Bank B and vice versa) is the Bank to Bank delay time (t
RRD
). The maximum
time that each bank can be held active is specified as t
RAS
(max).
Read and Write Access Modes
After a bank has been activated , a read or write cycle can be followed. This is accomplished by setting RAS high and CAS low at
the clock rising edge after minimum of t
RCD
delay. WE pin voltage level defines whether the access cycle is a read operation (WE
high), or a write operation (WE low). The address inputs determine the starting column address.
Reading or writing to a different row within an activated bank requires the bank be precharged and a new Bank Activate
command be issued. When more than one bank is activated, interleaved bank Read or Write operations are possible. By using the
programmed burst length and alternating the access and precharge operations between multiple banks, seamless data access
operation among many different pages can be realized. Read or Write Commands can also be issued to the same bank or between
active banks on every clock cycle.
相關PDF資料 |
PDF描述 |
|---|---|
| W986408CH | 2M x 8BIT x 4 BANKS SDRAM |
| W986408CH-75 | x8 SDRAM |
| W986408CH-8H | x8 SDRAM |
| W986416AH | 1M words x 16 bit x 4 Banks SDRAM(1M字 x 16 位 x 4 組同步動態RAM) |
| W986416BH | 1M words x 16 bit x 4 Banks SDRAM(1M字 x 16 位 x 4 組同步動態RAM) |
相關代理商/技術參數 |
參數描述 |
|---|---|
| W986408CH | 制造商:WINBOND 制造商全稱:Winbond 功能描述:2M x 8BIT x 4 BANKS SDRAM |
| W986408CH-75 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:x8 SDRAM |
| W986408CH-8H | 制造商:WINBOND 制造商全稱:Winbond 功能描述:x8 SDRAM |
| W986416CH | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1M x 16 BIT x 4 BANKS SDRAM |
| W986416CH-6 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:x16 SDRAM |
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