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參數資料
| 型號： | W921F840 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | 4-Bit Microcontroller(4位的微控制器) |
| 中文描述： | 4位微控制器（第4位的微控制器） |
| 文件頁數： | 2/68頁 |
| 文件大小： | 451K |
| 代理商： | W921F840 |
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W921F840
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6.13.1 Normal Mode:.....................................................................................................................37
6.13.2 Hold Mode:.........................................................................................................................37
6.13.3 Stop Mode:.........................................................................................................................40
6.14 Reset ..............................................................................................................................................41
6.14.1 Reset by
RESET
.................................................................................................................42
6.14.1 Reset by Watch Dog Timer.................................................................................................42
7. EEPROM FUNCTION...............................................................................................................................43
7.1 Pin Description of EEPROM Function..............................................................................................43
7.2 EEPROM Program/Erase Mode Selection......................................................................................43
7.3 Initial Condition Registers Program Method.....................................................................................44
7.4 Internal ROM
EEPROM (Super EEPROM) Program Method.....................................................45
7.5 Interal RAM
Flash EEPROM Program Method...........................................................................46
7.5.1 Program by EEPROM Writer (Hardware)............................................................................46
7.5.2 Program by Instruction (Software)........................................................................................47
8. ABSOLUTION MAXIMUM RATINGS .......................................................................................................50
9. ELECTRICAL CHARACTERISTICS.........................................................................................................51
9.1 DC Characteristics...........................................................................................................................51
9.2 AC Characteristics...........................................................................................................................52
9.3 DC Characteristics of Programming/Erase Operation.....................................................................53
9.4 AC Characteristics of Programming/Erase Operation .....................................................................54
10. ADDRESSING MODE............................................................................................................................55
10.1 ROM Addressing Mode..................................................................................................................55
10.1.1 Short Jump Addressing Mode: (1 word / 1 cycle for JMPS)...............................................55
10.1.2 Indirect Call Addressing Mode: (1 word / 2 cycles).............................................................55
10.1.3 Long Call/Jump Addressing Mode: (2 words / 2 cycles).....................................................56
10.2 RAM Addressing Mode..................................................................................................................56
10.2.1 Direct Addressing Mode: (2 words / 2 cycles) ....................................................................56
10.2.2 Indirect Addressing Mode: (1 word / 1 cycle)......................................................................56
10.2.3 Working Register Addressing Mode: (1 word / 1 cycle)......................................................57
10.3 Look-up Table Addressing Mode (1 word / 2 cycles).....................................................................57
11. INSTRUCTION CODE MAP...................................................................................................................59
12. INSTRUCTION SET SUMMARY............................................................................................................63
13. PACKAGE DIMENSIONS.......................................................................................................................67
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