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參數資料
型號： W83697HF
廠商： WINBOND ELECTRONICS CORP
元件分類： 外設及接口
英文描述： WINBOND I/O
中文描述： MULTIFUNCTION PERIPHERAL, PQFP128
封裝： PLASTIC, QFP-128
文件頁數： 7/167頁
文件大小： 1094K
代理商： W83697HF
W83697HF/F
Publication Release Date: Feb. 2002
- V - Revision 0.70
9.7.20 BEEP Control Register 2-- Index 57h (Bank 0)...........................................................................................106
9.7.21 Chip ID -- Index 58h (Bank 0).........................................................................................................................107
9.7.22 Reserved Register -- Index 59h (Bank 0)......................................................................................................107
9.7.23 PWMOUT1 Control -- Index 5Ah (Bank 0)....................................................................................................108
9.7.24 PWMOUT2 Control -- Index 5Bh (Bank 0)....................................................................................................108
9.7.25 PWMOUT1/2 Clock Select -- Index 5Ch (Bank 0).......................................................................................108
9.7.26 VBAT Monitor Control Register -- Index 5Dh (Bank 0).............................................................................108
9.7.27 Reserved Register -- 5Eh (Bank 0)................................................................................................................109
9.7.28 Reserved Register -- Index 5Fh (Bank 0)......................................................................................................109
9.7.29 Temperature Sensor 2 Temperature (High Byte) Register - Index 50h (Bank 1)...................................109
9.7.30 Temperature Sensor 2 Temperature (Low Byte) Register - Index 51h (Bank 1)....................................109
9.7.31 Temperature Sensor 2 Configuration Register - Index 52h (Bank 1)......................................................110
9.7.32 Temperature Sensor 2 Hysteresis (High Byte) Register - Index 53h (Bank 1)........................................110
9.7.33 Temperature Sensor 2 Hysteresis (Low Byte) Register - Index 54h (Bank 1).........................................111
9.7.34 Temperature Sensor 2 Over-temperature (High Byte) Register - Index 55h (Bank 1)..........................111
9.7.35 Temperature Sensor 2 Over-temperature (Low Byte) Register - Index 56h (Bank 1)...........................112
9.7.36 Interrupt Status Register 3 -- Index 50h (BANK4).......................................................................................112
9.7.37 SMI# Mask Register 3 -- Index 51h (BANK 4) ...........................................................................................113
9.7.38 Reserved Register -- Index 52h (Bank 4).......................................................................................................113
9.7.39 BEEP Control Register 3-- Index 53h (Bank 4)...........................................................................................113
9.7.40 Temperature Sensor 1 Offset Register -- Index 54h (Bank 4).....................................................................114
9.7.41 Temperature Sensor 2 Offset Register -- Index 55h (Bank 4).....................................................................114
9.7.42 Reserved Register -- Index 57h--58h...............................................................................................................114
9.7.43 Real Time Hardware Status Register I -- Index 59h (Bank 4)....................................................................115
9.7.44 Real Time Hardware Status Register II -- Index 5Ah (Bank 4)..................................................................115
9.7.45 Real Time Hardware Status Register III -- Index 5Bh (Bank 4).................................................................116
9.7.46 Reserved Register -- Index 5Ch (Bank 4).......................................................................................................117
9.7.47 VID Output Register -- Index 5Dh (Bank 4)..................................................................................................117
9.7.48 Value RAM 2Index 50h - 5Ah (auto-increment) (BANK 5)....................................................................117
9.7.49 Winbond Test Register -- Index 50h (Bank 6)...............................................................................................117
9.7.50 FAN 1 Pre-Scale Register
ndex00h.............................................................................................................117
9.7.51 FAN 1 Duty Cycle Select Register-- 01h (Bank 0).......................................................................................118
9.7.52 FAN 2 Pre-Scale Register-- Index 02h............................................................................................................118
9.7.53 FAN2 Duty Cycle Select Register-- Index 03h ..............................................................................................119
9.7.54 FAN Configuration Register-- Index 04h.......................................................................................................119
相關PDF資料
PDF描述
W83697 WINBOND I/O
W83697F WINBOND I/O
W83697SF WINBOND I/O
W83757 SUPER I/O CHIP
W83759 ADVANCED VL-IDE DISK CONTROLLER
相關代理商/技術參數
參數描述
W83697HF_05 制造商:WINBOND 制造商全稱:Winbond 功能描述:LPC I/O
W83697HG 功能描述:IC LPC SUPER I/O 128-PQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標準包裝:3,000 系列:- 應用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應商設備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
W83697SF 制造商:WINBOND 制造商全稱:Winbond 功能描述:WINBOND I/O
W83697UF 制造商:WINBOND 制造商全稱:Winbond 功能描述:LPC I/O
W83697UG 功能描述:IC LPC SUPER I/O 128-PQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標準包裝:3,000 系列:- 應用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應商設備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
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