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參數(shù)資料
型號： W83697HF
廠商： WINBOND ELECTRONICS CORP
元件分類： 外設(shè)及接口
英文描述： WINBOND I/O
中文描述： MULTIFUNCTION PERIPHERAL, PQFP128
封裝： PLASTIC, QFP-128
文件頁數(shù)： 78/167頁
文件大小： 1094K
代理商： W83697HF
W83697HF/F
Publication Release Date: Feb. 2002
Revision 0.70
- 69 -
6.3 Extended Capabilities Parallel (ECP) Port
This
port is software and hardware compatible with existing parallel ports, so it may be used as a
standard printer mode if ECP is not required. It provides an automatic high burst-bandwidth channel that
supports DMA for ECP in both the forward (host to peripheral) and reverse (peripheral to host) directions.
Small FIFOs are used in both forward and reverse directions to improve the maximum bandwidth
requirement. The size of the FIFO is 16 bytes. The ECP port supports an automatic handshake for the
standard parallel port to improve compatibility mode transfer speed.
The ECP port supports run-length-encoded (RLE) decompression (required) in hardware. Compression is
accomplished by counting identical bytes and transmitting an RLE byte that indicates how many times
the next byte is to be repeated. Hardware support for compression is optional.
For more information about the ECP Protocol, refer to the Extended Capabilities Port Protocol and ISA
Interface Standard.
6.3.1 ECP Register and Mode Definitions
NAME
data
ecpAFifo
dsr
dcr
cFifo
ecpDFifo
tFifo
cnfgA
cnfgB
ecr
ADDRESS
Base+000h
Base+000h
Base+001h
Base+002h
Base+400h
Base+400h
Base+400h
Base+400h
Base+401h
Base+402h
I/O
R/W
R/W
R
R/W
R/W
R/W
R/W
R
R/W
R/W
ECP MODES
000-001
011
All
All
010
011
110
111
111
All
FUNCTION
Data Register
ECP FIFO (Address)
Status Register
Control Register
Parallel Port Data FIFO
ECP FIFO (DATA)
Test FIFO
Configuration Register A
Configuration Register B
Extended Control Register
Note: The base addresses are specified by CR23, which are determined by configuration register or hardware setting.
MODE
000
001
010
011
100
101
110
111
DESCRIPTION
SPP mode
PS/2 Parallel Port mode
Parallel Port Data FIFO mode
ECP Parallel Port mode
EPP mode (If this option is enabled in the CR9 and CR0 to select ECP/EPP mode)
Reserved
Test mode
Configuration mode
Note: The mode selection bits are bit 7-5 of the Extended Control Register.
相關(guān)PDF資料
PDF描述
W83697 WINBOND I/O
W83697F WINBOND I/O
W83697SF WINBOND I/O
W83757 SUPER I/O CHIP
W83759 ADVANCED VL-IDE DISK CONTROLLER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W83697HF_05 制造商:WINBOND 制造商全稱:Winbond 功能描述:LPC I/O
W83697HG 功能描述:IC LPC SUPER I/O 128-PQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
W83697SF 制造商:WINBOND 制造商全稱:Winbond 功能描述:WINBOND I/O
W83697UF 制造商:WINBOND 制造商全稱:Winbond 功能描述:LPC I/O
W83697UG 功能描述:IC LPC SUPER I/O 128-PQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
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